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推进企业技术创新
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推进企业技术创新
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On August 14th, the China Petroleum and Chemical Industry Federation issued a notice on the issuance of the first batch of group standard project plans for the China Petroleum and Chemical Industry Federation in 2023. The application was organized by the Epoxy Resin Special Committee of the Petrochemical Federation and the Beijing National Chemical New Materials Technology Research Institute, and drafted by Zhilun Ultra Pure Epoxy Resin (Xi'an) Co., Ltd The group standard of "High Purity and Low Chlorine Bisphenol F Epoxy Resin" has successfully passed the project approval review.
Recently, our company has completed the excess fund-raising of angel round of tens of millions of RMB. This round of financing was jointly led by two funds under Shaanxi Investment Group - Provincial Enterprise Innovation Investment Fund and Carrying on Capital Innovation Investment Fund. Meanwhile, we got the active participation of Zhongxing Telecom Equipment (ZTE), China Securities Co.,Ltd (CSC), Suzhou Shangyin Guofa Venture Capital Partnership, Xi'an Lianhu Science and Technology Innovation Investment Fund Partnership and other head funds in the industry. This round of financing will be used entirely for the technical research and development and upgrading and iteration of existing products, the acquisition of factory automated production lines, the construction of research and development centers, as well as supplementing operating capital. It provides strong support for the company to realize leapfrog development, promote in-depth cooperation between upstream and downstream head enterprises, and occupy the high-end market of domestic and international electronic-grade epoxy resin.
The opening ceremony and expert report of this year's annual summit forum were attended by government leaders, industry renowned experts, scholars, and entrepreneurs as speakers, elaborating on China's semiconductor industry policies and development directions, and jointly exploring the innovative development issues of China's semiconductor packaging and testing industry. The summit forum was chaired by Xu Dongmei, Secretary General of the Sealing and Testing Branch of the China Semiconductor Industry Association.