General-purpose epoxy resin is a thermosetting resin with over two epoxy groups per molecule, mostly polycondensed from bisphenol A and epichlorohydrin. It is a transparent viscous liquid or brittle solid, soluble in ketones, esters and other solvents. Thermoplastic in its raw state, it requires curing agents like amines and acid anhydrides to form a 3D network cured product, with no small molecule volatilization and low shrinkage during curing. The cured resin has excellent properties: strong adhesion to metals, glass, wood and other materials (known as "universal adhesive"), high mechanical strength, good electrical insulation, and resistance to oil, acids and alkalis. With good processability, it is widely used in anti-corrosion coatings, structural adhesives, electronic packaging, composite materials and floor engineering, meeting the needs of electrical, mechanical, construction and other industries.

Special epoxy resins are high-performance thermosetting resins obtained through molecular structure modification or functional modification. Compared with general-purpose types, they have achieved breakthroughs in extreme environment adaptability and special functions. By adjusting their chemical composition, they can be customized to possess properties such as high temperature resistance, strong corrosion resistance, high insulation, or ultra-toughness, with some maintaining stable performance in extreme temperature ranges or strong chemical media. These resins offer flexible processability, being compatible with various molding methods including compression molding and injection molding. After curing, they form a dense cross-linked structure, combining high strength with dimensional stability. Widely used in aerospace structural components, electronic packaging, deep-sea equipment protection, and new energy fields, they also show potential in high-end scenarios such as medical devices, providing material solutions for harsh environments.

High-purity low-chlorine epoxy diluents are reactive epoxy additives refined via special processes such as composite catalysis and precise dechlorination, which significantly reduce the contents of total chlorine and hydrolyzable chlorine, with impurity control meeting electronic-grade standards. Mostly appearing as colorless transparent liquids, they are low-odor and low-irritation, boasting strong viscosity-reducing capacity and excellent processability. Compatible and reactive with various epoxy resins and curing agents, they do not affect the curing efficiency of the system. Their core advantage lies in extremely low ionic contamination, which can avoid electrochemical corrosion and signal interference of electronic components while improving the insulation, yellowing resistance and mechanical properties of cured products. Widely suitable for scenarios such as electronic packaging, high-temperature resistant insulation castings, high-end adhesives and composite materials, they provide reliable material solutions for harsh fields like semiconductors and outdoor electronics.