Product
Dimer acid modified bisphenol A epoxy resin ZLM-200H

Dimer acid modified bisphenol A epoxy resin ZLM-200H

High purity, low total chlorine
Improve adhesion and peel strength
Enhance toughness and impact strength

华南负责人:魏经理 18891555602 蔡经理 18049652996

华东负责人:曹经理 18189242081

西南 西北:徐经理 15091761603

外贸负责人:朱经理 13122525601

产品详情

【Chemical Composition】Dimer Acid Modified Bisphenol A Epoxy Resin

【Technical Indicators】

Dimer Acid Modified Bisphenol A Epoxy ResinEpoxy Equivalent (g/mol)Color (Gardner)Viscosity (mPa·s/25℃)Hydrolyzable Chlorine (ppm)Total Chlorine (ppm)
ZLM-DEH(H)210-220<1012000-14000<150<600
ZLM-DEH(L)195-205<109000-10000<150<600

【Properties】

This product is a high-purity modified epoxy resin with ultra-low total chlorine. It is a pale yellow transparent liquid, insoluble in water, has good compatibility with dimer acid systems, and is odorless.

The dielectric constant and dielectric loss of the cured system are superior to those of resin systems cured after dilution with monoepoxy glycidyl ether.

【Application Fields】

This product is a bisphenol A epoxy resin modified with dimer acid, which can be used in coatings, lamination, electronic adhesives and other systems involving dimer acid polymerization, crosslinking, and cationic curing (thermal, UV), achieving thin-film forming (low viscosity) and flexibility of the system.


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