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Tetramethylbiphenyl epoxy resin

Tetramethylbiphenyl epoxy resin

염소 함량 ppm:
점도 25℃:
Tg:
서비스 전화:

제품 상세 정보

Chemical CompositionPolymer of 3,3 ', 5,5' - tetramethyl-4,4 '- hydroquinone and (chloromethyl) epoxyethane

【Performance and Application】 The product has low viscosity, low chlorine content, excellent heat and chemical resistance, and the cured resin exhibits good heat resistance and chemical stability. The product can be used in fields such as electronic packaging, copper-clad laminates, inks, etc.

【technical indicators】

Tetramethylhydroquinone epoxyEpoxy equivalent(g/eq)melting point(℃)viscosity(mPa.s/150℃)Easily hydrolyzed chlorine(ppm)Total chlorine(ppm)
ZLE-4000H178-188
105-115
5-20
<200<800
ZLE-4000U<100<300


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